The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading
Cai, Yan-hong, Chen, Hao-ran, Tang, Li-qiang, Yan, Cheng, & Jiang, Wan (2008) The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading. Applied Mathematics and Mechanics, 29(1), pp. 1-10.
This paper investigated the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. The materials damage was considered. By introducing dislocation density function and using integral transform, the problem was reduced to algebraic equations and could be solved with collocation dots method in the Laplace domain. Finally, the time response of DSIF was calculated with the inverse Laplace integral transform. The conclusions show that the mode DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, but decreases with swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propaga-tion. The singular index of crack tip is -0.5 and independent on the physical parameters and damage conditions of materials and time. The oscillatory index is controlled by vis-coelastic material parameters.
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|Item Type:||Journal Article|
|Additional Information:||For more information, please refer to the journal’s website (see hypertext link) or contact the author.|
|Keywords:||dynamic stress intensity factor, interface crack, adhesively bonded materials, damage|
|Subjects:||Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200) > Materials Engineering not elsewhere classified (091299)|
Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200) > Functional Materials (091205)
|Divisions:||Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering|
Past > Schools > School of Engineering Systems
|Copyright Owner:||Copyright 2008 Springer-Verlag|
|Copyright Statement:||The original publication is available at SpringerLink http://www.springerlink.com|
|Deposited On:||05 Mar 2009 12:29|
|Last Modified:||29 Feb 2012 23:47|
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