Nonlinear analysis of a Ball Grid Array package under thermal cycles

Bai, Ruixiang, Jiang, Hao, & Yan, Cheng (2008) Nonlinear analysis of a Ball Grid Array package under thermal cycles. Advanced Materials Research, 32, pp. 57-60.

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In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) package subjected to thermal cycling were investigated using 2D and 3D finite element analyses. The viscous behavior of the adhesive material and thermal mismatch between the dissimilar materials in the package were considered. The potential failure sites in the solider and adhesive joints were analyzed.

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ID Code: 18647
Item Type: Journal Article
Refereed: Yes
Keywords: interface, adhesive joint, microelectronic packaging, thernal cycle, sold joint
DOI: 10.4028/
ISSN: 1022-6680
Divisions: Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering
Past > Schools > School of Engineering Systems
Copyright Owner: Copyright 2008 Trans Tech Publications
Deposited On: 12 Mar 2009 00:23
Last Modified: 29 Feb 2012 13:47

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