Bonding of aluminum alloy by hot-dipping tin coating
Diao, Hui (2008) Bonding of aluminum alloy by hot-dipping tin coating. Advanced Materials Research, 32, pp. 93-98.
This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.
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|Item Type:||Journal Article|
|Keywords:||hot-dipping, soldering, intermetallic compounds|
|Subjects:||Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200)|
|Divisions:||Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering|
Past > Schools > School of Engineering Systems
|Copyright Owner:||Copyright 2008 Trans Tech Publications Ltd.|
|Deposited On:||22 Oct 2010 14:01|
|Last Modified:||23 Oct 2010 00:45|
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