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Bonding of aluminum alloy by hot-dipping tin coating

Diao, Hui (2008) Bonding of aluminum alloy by hot-dipping tin coating. Advanced Materials Research, 32, pp. 93-98.

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Abstract

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.

Impact and interest:

2 citations in Scopus
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1 citations in Web of Science®

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ID Code: 38112
Item Type: Journal Article
Keywords: hot-dipping, soldering, intermetallic compounds
DOI: 10.4028/www.scientific.net/AMR.32.93
ISSN: 1022-6680
Subjects: Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200)
Divisions: Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering
Past > Schools > School of Engineering Systems
Copyright Owner: Copyright 2008 Trans Tech Publications Ltd.
Deposited On: 22 Oct 2010 14:01
Last Modified: 23 Oct 2010 00:45

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