A nanoscratch method for measuring hardness of thin films
Liu, Sheng, Huang, Han, & Gu, YuanTong (2011) A nanoscratch method for measuring hardness of thin films. International Journal of Nanomanufacturing, 7(5/6), pp. 427-435.
Thin solid films were extensively used in the making of solar cells, cutting tools, magnetic recording devices, etc. As a result, the accurate measurement of mechanical properties of the thin films, such as hardness and elastic modulus, was required. The thickness of thin films normally varies from tens of nanometers to several micrometers. It is thus challenging to measure their mechanical properties. In this study, a nanoscratch method was proposed for hardness measurement. A three-dimensional finite element method (3-D FEM) model was developed to validate the nanoscratch method and to understand the substrate effect during nanoscratch. Nanoindentation was also used for comparison. The nanoscratch method was demonstrated to be valuable for measuring hardness of thin solid films.
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|Item Type:||Journal Article|
|Keywords:||thin film, nanoscratch, finite element method, hardness|
|Subjects:||Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200) > Materials Engineering not elsewhere classified (091299)|
Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MECHANICAL ENGINEERING (091300) > Mechanical Engineering not elsewhere classified (091399)
|Divisions:||Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering|
Past > Schools > School of Engineering Systems
|Copyright Owner:||Copyright 2011 InderScience Publishers|
|Deposited On:||21 Nov 2011 08:45|
|Last Modified:||02 Jan 2012 23:03|
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