A nanoscratch method for measuring hardness of thin films

Liu, Sheng, Huang, Han, & Gu, YuanTong (2011) A nanoscratch method for measuring hardness of thin films. International Journal of Nanomanufacturing, 7(5/6), pp. 427-435.

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Thin solid films were extensively used in the making of solar cells, cutting tools, magnetic recording devices, etc. As a result, the accurate measurement of mechanical properties of the thin films, such as hardness and elastic modulus, was required. The thickness of thin films normally varies from tens of nanometers to several micrometers. It is thus challenging to measure their mechanical properties. In this study, a nanoscratch method was proposed for hardness measurement. A three-dimensional finite element method (3-D FEM) model was developed to validate the nanoscratch method and to understand the substrate effect during nanoscratch. Nanoindentation was also used for comparison. The nanoscratch method was demonstrated to be valuable for measuring hardness of thin solid films.

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ID Code: 47109
Item Type: Journal Article
Refereed: Yes
Keywords: thin film, nanoscratch, finite element method, hardness
DOI: 10.1504/IJNM.2011.043680
ISSN: 1746-9392
Subjects: Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200) > Materials Engineering not elsewhere classified (091299)
Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MECHANICAL ENGINEERING (091300) > Mechanical Engineering not elsewhere classified (091399)
Divisions: Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering
Copyright Owner: Copyright 2011 InderScience Publishers
Deposited On: 20 Nov 2011 22:45
Last Modified: 21 Jun 2017 20:49

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