Hardness of silicon nitride thin films characterised by nanoindentation and nanoscratch deconvolution methods
Liu, Sheng, Huang, Han, & Gu, YuanTong (2012) Hardness of silicon nitride thin films characterised by nanoindentation and nanoscratch deconvolution methods. Materials Science and Technology, 28(9-10), pp. 1172-1176.
Plasma enhanced chemical vapour deposition silicon nitride thin films are widely used in microelectromechanical system devices as structural materials because the mechanical properties of those films can be tailored by adjusting deposition conditions. However, accurate measurement of the mechanical properties, such as hardness, of films with thicknesses at nanometric scale is challenging. In the present study, the hardness of the silicon nitride films deposited on silicon substrate under different deposit conditions was characterised using nanoindentation and nanoscratch deconvolution methods. The hardness values obtained from the two methods were compared. The effect of substrate on the measured results was discussed.
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|Item Type:||Journal Article|
|Keywords:||Thin film, Nanoindentation, Nanoscratch, Hardness|
|Subjects:||Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200) > Metals and Alloy Materials (091207)|
Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MECHANICAL ENGINEERING (091300) > Numerical Modelling and Mechanical Characterisation (091307)
|Divisions:||Current > Schools > School of Chemistry, Physics & Mechanical Engineering|
Past > QUT Faculties & Divisions > Faculty of Science and Technology
|Deposited On:||03 Sep 2012 08:41|
|Last Modified:||13 Jun 2013 01:09|
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