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Calorimetric and rheological characterization of a high-performance epoxy curable at low temperatures

Rocks, Jens, Halter, M. , George, Graeme A., & Vohwinkel, Frederich (2003) Calorimetric and rheological characterization of a high-performance epoxy curable at low temperatures. Polymer International, 52(11), pp. 1749-1757.

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Abstract

Curing and gelation of N,N,N’,N’-tetraglycidyl-4,4’-diaminodiphenylmethane (TGDDM-Araldite MY721), in the presence of an anhydride hardener mixture was studied by calorimetric and dynamic rheological measurements. Cure kinetics of the homogeneous and low temperature curable epoxy-system were evaluated from 40oC to 140oC and apparent activation energies of the curing reaction were calculated from different thermokinetic models. By comparison of different calorimetric and rheological methods, it was found that the results from the isothermal calorimetric measurements are in a good agreement with the results obtained from isothermal rheological experiments, while the kinetic parameter calculations based on dynamic calorimetric measurements are not reliable results. These differences mainly arise from the fact that dynamic measurements have many underlying assumptions and do not consider the equilibrium condition.

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10 citations in Scopus
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7 citations in Web of Science®

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ID Code: 56
Item Type: Journal Article
Keywords: Epoxy, Anhydride Curing, Low Temperature Curing Networks, Differential Scanning Calorimetry, Dynamic Rheometry
DOI: 10.1002/pi.1285
ISSN: 0959-8103
Subjects: Australian and New Zealand Standard Research Classification > CHEMICAL SCIENCE (030000) > MACROMOLECULAR AND MATERIALS CHEMISTRY (030300) > Physical Chemistry of Materials (030304)
Divisions: Past > QUT Faculties & Divisions > Faculty of Science and Technology
Past > Schools > School of Physical & Chemical Sciences
Copyright Owner: Copyright 2003 Society of Chemical Industry
Copyright Statement: The definite version is available on publication at www3.interscience.wiley.com
Deposited On: 14 Mar 2005
Last Modified: 29 Feb 2012 23:02

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