Monitoring cuprous ion transport by scanning electrochemical microscopy during the course of copper electrodeposition

O'Mullane, Anthony P., Neufeld, Aaron K., & Bond, Alan M. (2008) Monitoring cuprous ion transport by scanning electrochemical microscopy during the course of copper electrodeposition. Journal of the Electrochemical Society, 155(8), D538-D541.

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Abstract

Scanning electrochemical microscopy (SECM), in the substrate generation–tip collection (SG-TC) mode, has been used to detect the cuprous ion intermediate formed during the course of electrodeposition of Cu metal from aqueous solution. Addition of chloride is confirmed to strongly stabilize the ion in aqueous solution and enhance the rate of Cu electrodeposition. This SECM method in the SG-TC mode offers an alternative to the rotating ring disk electrode (RRDE) technique for in situ studies on the effect of plating bath additives in metal electrodeposition. An attractive feature of the SECM relative to the RRDE method is that it allows qualitative aspects of the electrodeposition process to be studied in close proximity to the substrate in a simple and direct fashion using an inexpensive probe, and without the need for forced convection.

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7 citations in Web of Science®

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ID Code: 64299
Item Type: Journal Article
Refereed: Yes
DOI: 10.1149/1.2936177
ISSN: 0013-4651
Divisions: Current > Schools > School of Chemistry, Physics & Mechanical Engineering
Current > QUT Faculties and Divisions > Science & Engineering Faculty
Deposited On: 19 Nov 2013 23:12
Last Modified: 21 Nov 2013 05:13

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