Polycarbonate based non-chemically amplified photoresists for extreme ultraviolet lithography
Blakey, Idriss, Blinco, James P., Yu, Anguang, Jack, Kevin S., Liu, Heping, Leeson, Michael J., Yeuh, Wang, Younkin, Todd R., & Whittaker, Andrew K. (2010) Polycarbonate based non-chemically amplified photoresists for extreme ultraviolet lithography. In Proceedings of SPIE-The International Society for Optical Engineering. SPIE-INT SOC OPTICAL ENGINEERING.
Some initial EUVL patterning results for polycarbonate based non-chemically amplified resists are presented. Without full optimization the developer a resolution of 60 nm line spaces could be obtained. With slight overexposure (1.4 × E0) 43.5 nm lines at a half pitch of 50 nm could be printed. At 2x E0 a 28.6 nm lines at a half pitch of 50 nm could be obtained with a LER that was just above expected for mask roughness. Upon being irradiated with EUV photons, these polymers undergo chain scission with the loss of carbon dioxide and carbon monoxide. The remaining photoproducts appear to be non-volatile under standard EUV irradiation conditions, but do exhibit increased solubility in developer compared to the unirradiated polymer. The sensitivity of the polymers to EUV light is related to their oxygen content and ways to increase the sensitivity of the polymers to 10 mJ cm-2 is discussed.
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|Item Type:||Book Chapter|
|Divisions:||Current > Schools > School of Chemistry, Physics & Mechanical Engineering
Past > QUT Faculties & Divisions > Faculty of Science and Technology
|Copyright Owner:||Copyright 2010 SPIE|
|Deposited On:||09 Apr 2014 23:44|
|Last Modified:||26 Oct 2015 16:01|
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