Nonlinear analysis of plastic ball grid array solder joints

Yan, Cheng, Qin, Qinghua, & Mai, Yiu-Wing (2001) Nonlinear analysis of plastic ball grid array solder joints. Journal of Materials Science: Materials in Electronics, 12(11), pp. 667-673.

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Abstract

A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder joints in a ball grid array (BGA) package under temperature cycle. The effects of constraint on print circuit board (PCB) and stiffness of substrate on the deformation behaviour of the solder joints were also studied. A relative damage stress was adopted to analyze the potential failure sites in the solder joints. The results indicated that high inelastic strain and strain energy density were developed in the joints close to the package center. On the other hand, high constraint and high relative damage stress were associated with the joint closest to the edge of the silicon chip. The joint closest to the edge of the silicon chip was regarded as the most susceptible failure site if cavitation instability is the dominant failure mechanism. Increase the external constraint on the print circuit board (PCB) causes a slight increase in stress triaxiality (m/eq) and relative damage stress in the joint closest to the edge of silicon die. The relative damage stress is not sensitive to the Young’s modulus of the substrate.

Impact and interest:

10 citations in Scopus
8 citations in Web of Science®
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ID Code: 70367
Item Type: Journal Article
Refereed: Yes
Keywords: electronic packaging, numerical modeling, interface, solder joints
DOI: 10.1023/A:1012806218825
ISSN: 0957-4522
Subjects: Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MATERIALS ENGINEERING (091200) > Materials Engineering not elsewhere classified (091299)
Australian and New Zealand Standard Research Classification > ENGINEERING (090000) > MECHANICAL ENGINEERING (091300) > Numerical Modelling and Mechanical Characterisation (091307)
Australian and New Zealand Standard Research Classification > TECHNOLOGY (100000) > NANOTECHNOLOGY (100700) > Nanotechnology not elsewhere classified (100799)
Divisions: Current > Schools > School of Chemistry, Physics & Mechanical Engineering
Current > QUT Faculties and Divisions > Science & Engineering Faculty
Copyright Owner: Copyright 2001 Kluwer Academic Publishers
Copyright Statement: The final publication is available at Springer via http://dx.doi.org/10.1023/A:1012806218825
Deposited On: 23 Apr 2014 01:57
Last Modified: 14 May 2017 23:41

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