Numerical analysis for the interlayer toughening of piezoelectric smart composite plate
Bai, Ruixiang, Bai, Haitong, & Wang, Mingchao (2014) Numerical analysis for the interlayer toughening of piezoelectric smart composite plate. Polymers and Polymer Composites, 22(2), pp. 193-201.
The piezoelectric composite material could engender stress concentration resulting from small cracks during layers easily, as the cracks growth will lead to the failure of the whole structure. In this paper, a finite element model for piezoelectric composite materials by ABAQUS including interlayer crack was established, and the J integral and crack tip stress of different types PZT patches were calculated by using the equivalent integral method. Then, the J integral for adhesive layers with different thickness, elastic modulus considering and not considering piezoelectricity was investigated. The results show that the J integral of mode I, II reduces with thicker adhesive layer and lower elastic modules, and the J integral of mode II decreases more sharply than that of mode I.
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|Item Type:||Journal Article|
|Divisions:||Current > Schools > School of Chemistry, Physics & Mechanical Engineering
Current > QUT Faculties and Divisions > Science & Engineering Faculty
|Deposited On:||08 Oct 2015 00:02|
|Last Modified:||08 Oct 2015 00:02|
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