Molecular-resolved imaging of the Hierarchical Self-Assembly of a conductive polymer at single-walled carbon nanotube interfaces

Bell, John M., Goh, Roland, Motta, Nunzio, Musumeci, Anthony W., & Waclawik, Eric R. (2006) Molecular-resolved imaging of the Hierarchical Self-Assembly of a conductive polymer at single-walled carbon nanotube interfaces. In ICONN '06. International Conference on Nanoscience and Nanotechnology, 2006, 3-7 July 2006, USA.

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Molecular-resolved real-space images of self-assembled structures of the conductive polymer regioregular poly(3-hexylthiophene) (rrP3HT) on single-walled carbon nanotube (SWNT) substrates were obtained using scanning tunneling microscopy (STM). The STM images revealed that the adsorbed polymer formed a 10 nm thick coating on some SWNT's in agreement with previous transmission electron microscopy results. This thickness corresponds to a coating of ~25 layers of polymer on SWNT, assuming that pi-pi interactions between rrP3HT layers and the underlying SWNT directs the polymer self-assembly process. The polymer backbone interchain spacing (dcc = 1.55 nm) of the outermost layer of adsorbed rrP3HT is approximately 7% larger than is observed for rrP3HT adsorbed on HOPG (dcc = 1.45 nm). The polymer also wraps around the SWNT at an angle with respect to the SWNT long-axis, which indicates that rrP3HT self-assembly is hierarchical. The conductive polymer's deposition occurs with epitaxy and is directed by the underlying SWNT chiral structure.

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ID Code: 9461
Item Type: Conference Paper
Refereed: Yes
Additional URLs:
DOI: 10.1109/ICONN.2006.340692
ISBN: 1-4244-0453-3
Divisions: Past > QUT Faculties & Divisions > Faculty of Built Environment and Engineering
Copyright Owner: Copyright 2006 IEEE
Copyright Statement: Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Deposited On: 12 Sep 2007 00:00
Last Modified: 29 Feb 2012 13:27

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