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Browse By Person: Chen, Hongtao

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Journal Article

Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Li, Mingyu, & Huang, Y. (2007) Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging. Journal of Electronic Materials, 36(1), pp. 26-32.
Number of full-text downloads 504
Number of citations in Scopus 15
Number of citations in Web of Science® 13

Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Huang, Y., & Tian, Yanhong (2007) Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints. Journal of Electronic Materials, 36(1), pp. 33-39.
Number of full-text downloads 289
Number of citations in Scopus 8
Number of citations in Web of Science® 6

This list was generated on Sun Oct 19 04:59:03 2014 EST.