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Browse By Person: Huang, Y.

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Number of items: 2.

Journal Article

Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Li, Mingyu, & Huang, Y. (2007) Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging. Journal of Electronic Materials, 36(1), pp. 26-32.
Number of full-text downloads 273
Number of citations in Scopus 13
Number of citations in Web of Science 12

Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Huang, Y., & Tian, Yanhong (2007) Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints. Journal of Electronic Materials, 36(1), pp. 33-39.
Number of full-text downloads 182
Number of citations in Scopus 6
Number of citations in Web of Science 6

This list was generated on Sat May 18 06:57:28 2013 EST.