Browse By Person: Tian, Yanhong
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Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Huang, Y., & Tian, Yanhong (2007) Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints. Journal of Electronic Materials, 36(1), pp. 33-39.